Potting compounds offer superior protection for electronic circuits while encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. Factors such as handling and processing, open time, viscosity and cure schedules must be considered when determining which formulation to go with. Learn more about the performance properties of epoxies, silicones, UV curables, and B-staged epoxies, plus the packaging options available, to see which is best for the manufacturing and assembly of your electronic device.