Fungus resistance tested in accordance with MIL-STD-810G with Change 1, Method 508.7
Master Bond epoxy and silicone systems are non-nutrient and do not sustain or support mildew/mold/fungi or biological growth. This was recently tested using MIL-STD-810G with Change 1, Method 508.7 for fungus resistance. This is a stringent military standard that was developed by the U.S. Department of Defense. It is used to determine the extent to which a product will support fungal growth, how that growth can affect the performance of the material, and what specific species have grown.
Fungus growth is a function of temperature and humidity; it is most prevalent in warm and humid environments. In this test, the samples are inoculated with a spore suspension consisting of the following organisms:
- Aspergillus flavus
- Aspergillus versicolor
- Penicillium funiculosum
- Chaetomium globosum
- Aspergillus brasiliensis (formerly known as A.niger)
The samples are then placed in a test chamber and held at 30 ± 2 °C with 90-100% relative humidity for a minimum of 28 days. Following this containment, the samples are then immediately inspected by trained professionals. Each sample is assigned a growth rating from 0-4, 0 meaning that the substrate is devoid of microbial growth and 4 meaning massive microbial growth.
The following products were tested by an independent lab and received a growth rating of 0: