Glass microsphere filled two component epoxy and silicone adhesives/sealants, coatings and potting compounds offer enhanced performance properties. They reduce weight, improve thermal/electrical insulation and dimensional stability. These low density formulations provide increased hardness and stiffness. Low viscosity, free flowing compounds are frequently used in potting/encapsulation applications. Products have superb resistance to moisture, UV rays and many chemicals. Additionally they feature low shrinkage upon cure, excellent sound dampening characteristics and upgrade surface appearance.
These cost effective compounds contain a variety of particle sizes and densities to meet specific end use requirements. They are solvent free, cure at ambient temperatures and provide uniform bondline thickness when adhering two substrates. Effective utilization of these adhesives by design engineers has been proven successful in meeting weight minimization goals.