Master Bond Inc, Hackensack, N.J. has developed EP62-1MED, a new, two component epoxy adhesive system which features outstanding chemical and temperature resistance. This compound is specifically designed to withstand repeated cycles of steam, ethylene oxide, radiation and chemical sterilization.
Master Bond Polymer System Supreme 10HTFL is a new one component flexible high performance epoxy resin based adhesive/sealant with an exceptionally wide service temperature range of 4K to +350°F making it suitable for cryogenic applications. It cures readily to a tough, strong flexible thermoset polymer at temperatures of 250-300°F and above.
Master Bond Inc., Hackensack, N.J. has developed a new toughened one component heat curing epoxy adhesive/sealant, called EP17. This compound has a service operating range of from -300°F to as high as 600°F. It is formulated to cure at temperatures from 300°F to 350°F for 60-90 minutes.
Master Bond Supreme 3HT-80 is a new one component heat curing epoxy adhesive developed by Master Bond Inc. Supreme 3HT-80 exhibits both high shear and high peel strength. It offers superior resistance to impact, thermal shock, vibration and stress fatigue cracking. This no mix compound has an unlimited working life and cures within 30 minutes at 175°F (80°C).
Master Bond Inc. of Hackensack, New Jersey has developed a new two component, room temperature curing, nickel filled, electrically conductive epoxy adhesive called EP76M. EP76M has a convenient one to one mix
