Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required.
Electrical arcing is a challenge for numerous electronic or electrical devices; this occurs when electricity jumps from one connection to another, resulting in an electrical breakdown.

Master Bond EP4S-80 is a one component silver filled epoxy which meets NASA low outgassing requirements.
It has an unlimited working life at room temperature and a moderate heat cure requirement of 80°C.
With a viscosity of 10,000-15,000 cps, EP4S-80 has a smooth flow and is easily brushable, making it ideal for

Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications
where thermal conductivity and electrical insulation are required. With a high thermal conductivity value of 8-11 BTU•in/(ft2 •hr•°F) [1.16-1.60 W/(m•K)],

Master Bond EP62-1HTMed is a two part epoxy that meets the requirements of ISO 10993-5 for non-cytotoxicity
and therefore can be utilized in many medical device applications. It features high temperature resistance,
good flow properties and is suitable for bonding, sealing and coating.

Master Bond LED405FL3 is a flexible one component, LED curing adhesive system with excellent optical clarity and a refractive index of 1.51.
Its flexibility allows for stress minimization especially when bonding substrates with different coefficients of thermal expansion.
It also utilizes a fluorescent dye for detection purposes, which enables easy visual inspection.

Master Bond EP5G-80 is a one component, NASA low outgassing rated epoxy, with a moderate temperature cure requirement of 80°C for 4 hours.
This graphite filled compound is not premixed and frozen and has an unlimited working life at room temperature. It offers electrical conductivity