Master Bond LED401 is a breakthrough system based on LED technology. This adhesive, sealant, coating and encapsulant cures tack-free upon exposure to a 405 nm wavelength light source, without any oxygen inhibition. Optically clear, it is also safer and easier to handle than similar UV systems as LED lights emit substantially less heat than UV lamps.
With its outstanding light transmission properties and optical clarity, Master Bond UV15 is widely used for a variety of bonding, coating and sealing applications in the optical, electronic and optoelectronic industries. This epoxy based UV curable system is 100% reactive and does not contain any solvents or other volatiles. It is also completely free of any oxygen inhibition.
Master Bond Supreme 10HT is a uniquely versatile system that combines high shear and peel strengths with convenient handling. This one part system eliminates mixing and cures in just 60-75 minutes at 250°F. It can withstand severe cryogenic temperatures to extreme heat with a temperature range of 4K to +400°F.
Formulated for electrical potting and encapsulation applications, Master Bond EP36AO combines high thermal conductivity with thermal stability. This flexible, heat resistant epoxy has superior mechanical properties.
Offering a unique blend of high performance properties, Master Bond MasterSil 153 is often used in a variety of bonding and sealing applications involving optical, electrical, aerospace and medical devices. As an addition cured system, it does not require air for complete cross-linking. It can be cured over wide surface areas as well.
Master Bond elastomer system, EP30D-10, offers the strength, flexibility, performance, and adhesive qualities traditionally associated with epoxies, along with the toughness and abrasion resistance of polyurethanes. This two component adhesive is resistant to thermal cycling and chemicals including water, inorganic salts, acids, and alkalis.