Innovative high performance Master Bond formulations have the ability to facilitate exciting growth opportunities for the global power supply market.
Some examples of power supply devices include:
- AC/DC power modules,
- Uninterruptible Power Supply (UPS) systems,
- Linear power supply,
- SMPS – switch mode power supply systems,
- Battery and solar power battery supplies,
- High voltage Ac-Dc power supplies,
- RF power systems,
- Programmable power supplies, and
- Custom power supplies.
Our comprehensive line of products consists of potting/encapsulation compounds, conformal coatings, underfills to assembly adhesives, sealants, and heat dissipative bonding agents.
Special application specific Master Bond epoxies, silicones, and UV/light/dual (UV/light + heat) curable systems are able to be employed in the assembly of numerous power supply devices. Different grades provide resistance to chemicals, moisture, water, vibration, mechanical shock, impact, extreme temperatures and sudden temperature fluctuations. Special compounds offer low thermal resistance, which is critical for providing adequate heat dissipation on various electronic components.
Additionally, it is important to note that customized Master Bond compounds provide excellent toughness, a high elongation, and withstand thermal cycling. Several compounds also meet NASA low outgassing requirements combined with a wide service temperature range. Many products have excellent dielectric properties and convenient mix ratios for ease of application. These products have made an important contribution in the construction of smaller portable devices, improved energy efficiency, power, extended service life and lowering operating/maintenance expenses. Adaptation of these systems has been crucial in servicing end-user requests of customers in the following industries:
- Telecommunications
- Consumer Electronics
- Military and Aerospace
- Industrial Electrical Equipment
- Lighting
- Medical and Healthcare
- Shipping & Transportation