Potting Compounds for High Tech Connector Assembly ApplicationsConnector potting applications are prevalent in telecommunications, military, aerospace, automotive and electronics. Master Bond offers a large selection of environmentally friendly and technologically advanced potting compounds containing no solvents or volatiles with exceptional electrical insulation properties. Master Bond products are designed to simplify processing requirements, exhibit long-term durability, extend product life-cycles and provide strong performance even upon exposure to harsh environmental conditions. Special formulations are available including fast cures, room temperature cures, thermal conductivity, flame resistance and cryogenically serviceable.

Master Bond adhesives are presently employed in applications ranging from RF and DC connectors to hybrid connectors to usb cords. These low viscosity systems are easy to dispense and can be color coded to meet specific needs.

Master Bond materials offer protection from:

  • Moisture
  • Corrosive chemicals and corrosion
  • Abrasion
  • Excessive heat
  • Mechanical impact
  • Leak prevention
  • Vibration
  • Thermal shock

Additionally, grades are available that feature:

  • Low stress
  • Low outgassing
  • High Tg
  • Low shrinkage
  • Low coefficient of thermal expansion
  • Superior dimensional stability