One Component, Higher Viscosity UV Curable System for High Performance Bonding, Sealing and Coating, Featuring Excellent Physical Properties, Dimensional Stability and Chemical Resistance with an Outstanding Tg
One Component, Silver Conductive Epoxy Adhesive Featuring High Shear and High Peel Strengths. Uniquely Special System Cures between 175°F and 185°F with Physical Strength Properties and Excellent Conductivity.
Two Component, Very Low Viscosity, Room Temperature Curing Epoxy for Bonding, Sealing, Potting and Filament Winding with Exceptionally Low Exotherm and Long Working Life.