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LATEST PRODUCT

Underfill Epoxy Offers Thermal Conductivity and Electrical Insulation

Master Bond EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively...

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TECH TIPS

Comparison of Acetoxy Curing and Neutral Curing Silicones
Internet of Things (IoT)
Potting and Sealing Electronic Components
Modulus, Poisson’s Ratio and Elongation
All About Addition Curing Silicones

LATEST WHITE PAPER

Understanding Low Outgassing Adhesives

Engineers often want to know whether an adhesive is low outgassing or generic. And while there are cases when nothing but...

INDUSTRIAL CERTIFICATIONS

USP Class VI for biocompatibility
ISO 10993-5 for cytotoxicity
NASA low outgassing
FDA CFR 175.300 & 175.105
MIL-STD-810G for fungus resistance
MIL-STD-883J for thermal stability
FAR 25.853(a) for flame retardancy
UL 94V-0 & UL 94V-1
UL 1203 for explosion-proof
85°C/85% RH
See all certifications

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