The following is a news release from Master Bond Inc. You have received it because you are listed as an editor for your publication. Attached to this email is a low resolution version of the photograph that is included in the press kit for this product. A high resolution version of this image and files with the body text of this release in Word, HTML and text formats are available at https://www.masterbond.com/newsrelease/ep5lte-100. ----------------------------------------------------------------- FOR IMMEDIATE RELEASE Thixotropic Epoxy Features Low Coefficient of Thermal Expansion Master Bond EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE), high glass transition temperature (Tg), and extremely high modulus. It has a thixotropic paste consistency making it ideal for bonding, sealing and gap filling applications. These properties are especially useful for opto-electronics or applications needing high dimensional stability and good heat resistance. EP5LTE-100 passes NASA low outgassing specifications. It provides a tensile modulus that exceeds 1 million psi at room temperature. Minimal shrinkage upon cure combined with a low CTE of 8-12 x 10-6 in/in/°C enables precise alignment for bonding dissimilar substrates with low coefficients of thermal expansion. With a Tg between 120-125°C, and a service temperature range from -60°C to +175°C, this epoxy is effective in high temperature environments. It is a reliable electrical insulator featuring a volume resistivity of more than 1014 ohm-cm. EP5LTE-100 bonds well to a wide variety of substrates including metals, glass, composites, ceramics and many plastics. It has good resistance to water and damp heat. The compound has an unlimited working life at room temperature and requires a heat cure at 100°C for 90-120 minutes. Optimum properties are obtained by post curing for 2-3 hours at 100-125°C. The epoxy is available in syringes, jars, and cans. Master Bond Epoxies with Low Coefficient of Thermal Expansion Master Bond EP5LTE-100 is a dimensionally stable, low shrinkage compound formulated to provide an extra low coefficient of thermal expansion. It has good flow properties and may be used for bonding, sealing and gap filling. Read more about Master Bond’s adhesives with low coefficient of thermal expansion at https://www.masterbond.com/properties/epoxies-low-coefficient-thermal-expansion. Note to Editors: For a full product description, please visit: https://www.masterbond.com/tds/ep5lte-100 Check out new videos on our YouTube channel: https://www.youtube.com/user/MasterBondVideo You can embed any of our videos on your website. CONTACT James Brenner, Marketing Manager Email: jbrenner@masterbond.com Tel: +1-201-343-8983 Fax: +1-201-343-2132 MASTER BOND INC. 154 Hobart Street Hackensack, NJ 07601-3922 Web: www.masterbond.com # # #