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| Using the Dam & Fill Method to Protect Electronic Components |
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| Watch demonstration on how to apply dam and fill compounds |
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| Get an up close look at how the dam and fill process works to protect electronic components on a circuit board. This two step method utilizes a damming compound such as Supreme 3HTND-2DM-1 to create a barrier around the component, while the flowable filler material, EP3UF-1, covers the component for protection. |
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Copyright © 2022 by Master Bond Inc. All Rights Reserved.
This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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