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One Part, Silver Filled Epoxy for EMI/RFI Shielding
 
 
 
 
EP4S-80 cures at the low temperature of 80˚C
Master Bond Video
Master Bond EP4S-80 is a one component, silver filled epoxy for bonding, sealing and coating. This NASA low outgassing approved system cures at the low temperature of 80˚C and bonds well to a variety of substrates. Watch this video to see how this low viscosity compound can be dispensed through a syringe or brushed on to create a protective coating.
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