One Part, Silver Filled Epoxy for EMI/RFI Shielding
Master Bond EP4S-80 is a one component, silver filled epoxy that cures at 80˚C and bonds well to a variety of substrates. See how this low viscosity compound can be brushed on or dispensed through a syringe.
While bonding thermoplastic polyurethanes (TPUs) is known to be challenging, Master Bond has formulated UV17Med, a UV curable adhesive specially formulated for bonding many variations of TPUs.
Utilized in Development of Microfluidic Particle Generator
Master Bond EP41S-5 offers solvent and heat resistance making it the ideal fit for bonding steel compression fittings to glass wafers for use in this all-silicon/glass microfluidic particle generator.
Utilized as a Sensor Encapsulant in Prosthetic Device
Find out how researchers at the University of Tennessee were able to successfully utilize Master Bond EP30Med in their diagnostic tools which were then implanted into a prosthetic device.
Master Bond offers a look into the accurate, repeatable and reproducible testing methods we use to test the mechanical strength of our adhesive compounds.
Master Bond tested a variety of epoxies for their resistance to acetone. Cured samples of epoxy were immersed over a long period of time in acetone and weight changes were recorded weekly.
